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EKF SC6-TANGO Low Power CPU Card

BRAND : EKF

General
  • CompactPCI® Serial (PICMG® CPCI-S.0) System Slot Controller
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
  • Backplane communication via CompactPCI® Serial connectors
  • On-board SATA 6G mezzanine expansion option for mass storage modules or side cards
  • Side cards and low profile mass storage modules available as COTS and also as custom specific

Processor
  • Intel® Apollo Lake (APL-I) SoC E39xx Series
  • x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
  • x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
  • x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
  • Graphics Burst, CPU Burst, Intel® Speedstep®
  • Intel® Virtuali...

    Details

    General
    • CompactPCI® Serial (PICMG® CPCI-S.0) System Slot Controller
    • Form factor single size Eurocard (board dimensions 100x160mm2)
    • Mounting height 3U
    • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
    • Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
    • Backplane communication via CompactPCI® Serial connectors
    • On-board SATA 6G mezzanine expansion option for mass storage modules or side cards
    • Side cards and low profile mass storage modules available as COTS and also as custom specific

    Processor
    • Intel® Apollo Lake (APL-I) SoC E39xx Series
    • x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
    • x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
    • x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
    • Graphics Burst, CPU Burst, Intel® Speedstep®
    • Intel® Virtualization Technology (Intel® VT-x / VT-d)
    • Intel® Trusted Execution Engine (Intel® TXE) 3.0

    Firmware
    • Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
    • Fully customizable by EKF
    • Secure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®
    • Windows®, Linux and other (RT)OS' supported
    * CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS' 

    Main Memory
    • Integrated memory controller up to 8GB DDR3L 1600 +ECC
    • Completely soldered memory for rugged applications

    Mass Storage
    • On-board CFast™ Card socket (SATA based CompactFlash)
    • Option front I/O Micro SD Card socket (SDHC, SDXC), available on request
    • SPI Flash 128Mbit (UEFI firmware and customer application data)
    • Option e•MMC (embedded MMC 5.0 64GByte soldered)
    • Option low profile mezzanine card C41-CFAST (secondary CFast™ card socket) via P-HSE connector
    • Option low profile mezzanine card C42-SATA (1.8-inch Micro SATA SSD socket) via P-HSE connector
    • Option low profile mezzanine card C47-MSATA (dual mSATA SSD module sockets) via P-HSE connector
    • Option low profile mezzanine card C48-M2 (dual M.2 SATA SSD module sockets) via P-HSE connector
    • Option 8HP assembly side card PCU-UPTEMPO (dual M.2 SATA SSD module sockets) via P-HSE connector
    • Option 8HP assembly side card C44-SATA (2.5-inch SATA SSD/HDD) via P-HSE connector
    • Option custom specific mezzanine board design on request

    Graphics
    • Integrated HD Graphics Engine, Gen 9 LP
    • DirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3
    • HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8
    • HW video encode H264, SVC, AVC, MVC, MPEG-2
    • Content protection PAVP, HDCP 1.4
    • 2 x DisplayPort front panel connectors
    • DisplayPort™ 1.2a
    • Max Resolution 4096 x 2160 @60Hz

    Networking
    • Up to four networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
    • Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
    • IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
    • IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
    • IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
    • Two GbE ports via RJ45 front panel jacks (option 2 x M12-X with mezzanine module P01)
    • Option two GbE ports via backplane connector

    APL SoC I/O Usage
    • 4 x PCIe® Gen2 to backplane connectors, by default configured as 4 x 1 links
    • 1 x PCIe® Gen2 to PCIe® switch PI7C9X2G606PR 1:5 lanes (to on-board PCIe® devices)
    • 1 x SATA 6G to on-board CFast™ SSD card socket - can be used as mass storage and boot device
    • 1 x SATA 6G to mezzanine expansion connector P-HSE
    • e•MMC I/F 400MByte/s (HS400) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
    • 2 x USB 3.0 to front panel connectors
    • 2 x DisplayPort to front panel connectors
    • SDIO (Micro SD Card) front panel slot (option, available on request)
    • 4 x USB2 to J2 backplane connector
    • LPC, Audio, I2C, 2 x USB2 to mezzanine expansion connector P-EXP
    • LPC to TPM 2.0 module (option)

    Additional Building Blocks
    • Additional on-board controllers, PCIe® based
    • PCIe® Gen2 packet switch PI7C9X2G606PR (6-port, 6-lane)
    • 2 x Gigabit Ethernet controllers Intel® I210IT (front panel)
    • Option 2 x Intel® I210IT (via backplane connector)
    • Option dual port SATA 6G controller Marvell® 88SE9170 (to P-HSE mezzanine connector)
    • Option e•MMC (embedded MMC 5.0 64GByte HS400)

    Security
    • Trusted Platform Module (option)
    • TPM 2.0 for highest level of certified platform protection
    • Infineon Optiga™ SLB 9665 cryptographic processor
    • Conforming to TCG 2.0 specification
    • AES hardware acceleration support (Intel® AES-NI)

    Front Panel I/O (4HP)
    • 2 x Gigabit Ethernet RJ45 (2 x I210IT)
    • 2 x DisplayPort (APL SoC)
    • 2 x USB 3.0 Type-A (APL SoC)
    • Option Micro SD Card slot (APL SoC)

    Front Panel I/O (8HP)
    • Option RS-232, Audio, USB w. PCU-UPTEMPO side card
    • Option 2 x M12 X-coded receptacles for Gigabit Ethernet (as replacement for RJ45)
    • Custom specific front panel and side card design

    CompactPCI® Serial Backplane Resources
    • PICMG® CompactPCI® Serial CPU card (system slot controller)
    • Support for up to four PCIe® based CompactPCI® Serial peripheral boards, Gen2 x1 links
    • Option PCIe® 1 x4 link (manufacturing option)
    • Option 2 x Gigabit Ethernet (I210IT networking controllers) suitable for star and mesh backplanes
    • 4 x USB 2.0

    Local Expansion
    • Mezzanine side card connectors for optional local expansion
    • P-EXP - LPC, Audio, 2 x USB2, I2C (from APL SoC)
    • P-HSE - 1 x SATA 6G (HSE port 1, from APL SoC)
    • P-HSE - 2 x SATA 6G (HSE ports 2 and 3, from optional PCIe® to SATA controller 88SE9170)
    • P-HSE - 1 x PCIe® (HSE port 1, from APL SoC, replaces SATA channel, manufacturing option)
    • 4HP Low profile mezzanine module options (to be ordered separately)
    • CFast™ Card with C41-CFAST mezzanine module
    • SATA 1.8-Inch Solid State Drive with C42-SATA mezzanine module
    • Dual mSATA SSD with C47-MSATA mezzanine module
    • Dual M.2/NGFF SATA SSD 2230 - 2280 size with C48-M2 mezzanine module
    • M.2 PCIe® SSD S20-NVME mezzanine module
    • Custom specific module design
    • 8HP Mezzanine side card option (to be ordered separately)
    • PCU-UPTEMPO side board w. 2 x M.2 SATA sockets & front I/O
    • 2.5-inch SATA SSD/HDD available with C44-SATA
    • Custom specific side card design

    Environmental & Regulatory
    • Designed & manufactured in Germany
    • ISO 9001 certified quality management
    • Long term availability
    • Rugged solution
    • Coating, sealing, underfilling on request
    • Lifetime application support
    • RoHS compliant 2002/95/EC
    • EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
    • Operating temperature -40°C to +85°C (industrial temperature range)
    • Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
    • Humidity 5% ... 95% RH non Condensing
    • Altitude -300m ... +3000m
    • Shock 15g 0.33ms, 6g 6ms
    • Vibration 1g 5-2000Hz
    • MTBF 11.5 years

    RT OS Board Support Packages & Driver

    Applications
    • General low power industrial computing, for x86 based software
    • Rugged systems (e.g. transportation)
    • Data concentrator, router, gateway, kiosk systems, IoT
    • Stand-alone computer (fog computing), scalable via mezzanine I/O expansion options
    • Small modular CompactPCI® Serial systems for expansion with up to four peripheral cards