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EKF SC5-FESTIVAL Intel Xeon E3 v6 Mobile Processor

BRAND : EKF

General
  • CompactPCI® Serial (PICMG® CPCI-S.0) CPU card
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
  • Backplane communication via PCI Express® Gen3, SATA 6G, USB 3.0, Gigabit Ethernet
  • Local mezzanine expansion option, COTS and custom specific boards

Processor
  • Intel® Kaby Lake-H mobile platform with ECC (CM238 mobile workstation PCH)
  • Intel® Xeon® processor E3 v6 family (mobile workstation)
    • Xeon E3 1505M v6 • 3/4GHz • 8M • 4C/8T • DDR4 2400 ECC • 45/35W • GT2 - P630 • vPRO™
    • Xeon E3 1505L v6 • 2.2/3GHz • 8M • 4C/8T • DDR4 2400 ECC • 25W • GT2 - P630 • vPRO™
    • Xeon E3 1501M v6 • 2.9/3.6GHz • 6M • 4C/8T • DDR4 2400 ECC • 45/35W • GT2 - P630 • vPRO™
    • Xeon E3 1501L v6 • 2.1/2.9GHz • 6M • 4C/8T • DDR4 2400 ECC • 25W • GT2 - P630...

      Details

      General
      • CompactPCI® Serial (PICMG® CPCI-S.0) CPU card
      • Form factor single size Eurocard (board dimensions 100x160mm2)
      • Mounting height 3U
      • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
      • Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
      • Backplane communication via PCI Express® Gen3, SATA 6G, USB 3.0, Gigabit Ethernet
      • Local mezzanine expansion option, COTS and custom specific boards

      Processor
      • Intel® Kaby Lake-H mobile platform with ECC (CM238 mobile workstation PCH)
      • Intel® Xeon® processor E3 v6 family (mobile workstation)
        • Xeon E3 1505M v6 • 3/4GHz • 8M • 4C/8T • DDR4 2400 ECC • 45/35W • GT2 - P630 • vPRO™
        • Xeon E3 1505L v6 • 2.2/3GHz • 8M • 4C/8T • DDR4 2400 ECC • 25W • GT2 - P630 • vPRO™
        • Xeon E3 1501M v6 • 2.9/3.6GHz • 6M • 4C/8T • DDR4 2400 ECC • 45/35W • GT2 - P630 • vPRO™
        • Xeon E3 1501L v6 • 2.1/2.9GHz • 6M • 4C/8T • DDR4 2400 ECC • 25W • GT2 - P630 • vPRO™
      • 7th Generation Intel® Core™ mobile processor
        • i3 7100E • 2.9GHz • 3M • 2C/4T • DDR4 2400 ECC • 35W • GT2 - 630
        • i3 7102E • 2.1GHz • 3M • 2C/4T • DDR4 2400 ECC • 25W • GT2 - 630

      Firmware
      • Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
      • Fully customizable by EKF
      • Secure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®
      • Windows®, Linux and other (RT)OS' supported
      • Intel® AMT supported for Intel® Xeon® E3 v6 (disabled by default, must be enabled via BIOS setup)
      * CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'

      Main Memory
      • Integrated memory controller up to 32GB DDR4 2400 ECC +ECC
      • DDR4 +ECC soldered memory up to 16GB
      • DDR4 +ECC SO-DIMM memory module socket up to 16GB

      Graphics
      • Integrated HD Graphics Engine, 3 symmetric independent displays
      • 3D HW acceleration DirectX12, OpenCL 2.x, OpenGL 4.3/4.4, ES 2.0
      • HW video decode/encode HEVC10b 10-bit, VP9 10-bit, JPEG
      • HDR (High Dynamic Range) Rec. 2020 Wide Color Gamut
      • Content protection
      • UHD premium content playback
      • Front panel options: Dual DisplayPort (DP) connectors
      • 3rd DisplayPort optional via Type-C connector on low profile mezzanine card
      • Max resolution 4096 x 2304 @60Hz (any DisplayPort, concurrent operation)
      • DisplayPort™ 1.2 Multi-Stream Transport (MST) - display daisy chaining
      • MST max resolution via single DP connector 2880x1800@60Hz (2 displays), 2304x1440@60Hz (3 displays)
      • Integrated audio (3 independent audio streams)

      Networking
      • Up to 10 networking interfaces in total - 2 x front RJ45 GbE, option 8 x backplane or 4 x M12-X front
      • 1000BASE-T, 100BASE-TX, 10BASE-T connections
      • Front port 1 - I219LM with Intel® AMT support
      • Front port 2 - Intel® I210-IT -40°C to +85°C operating temperature GbE NIC w. integrated PHY
      • IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
      • IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
      • IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
      • Backplane Gigabit Ethernet option w. S80-P6 mezzanine module - Marvell Peridot switch
      • Backplane Gigabit Ethernet option w. S82-P6 mezzanine module - 4 x Intel® I210-IT NIC
      • Option front panel M12 X-coded GbE ports with SCL-RHYTHM side card (8HP front panel width)

      Chipset
      • Intel® CM238 Mobile Workstation Platform Controller Hub (PCH)
        • PCIe Gen3 8GT/s
        • SATA 6G
        • USB3
        • GbE
        • LPC, Audio, Legacy

      On-Board Building Blocks
      • Additional on-board devices, PCIe® based
      • 1 x Gigabit Ethernet controller Intel® I210IT
      • 1 x Gigabit Ethernet PHY Intel® I219LM
      • IEEE 1588-2008 Precision Time Protocol supported including PPS and PPM signals
      • SATA 6G RAID controller Marvell® 88SE9230 ARM powered subsystem for host CPU offload

      Security
      • Trusted Platform Module
      • TPM 2.0 for highest level of certified platform protection
      • Infineon Optiga™ SLB 9665 cryptographic processor
      • Conforming to TCG 2.0 specification
      • AES hardware acceleration support (Intel® AES-NI)

      Front Panel I/O (4HP)
      • 2 x Gigabit Ethernet RJ45 (1 = PCH & I219LM - Intel® AMT, 2 = I210IT)
      • 2 x DisplayPort (from processor integrated HD graphics engine, standard latching DP receptacles
      • 2 x USB 3.0
      • Option 2 x Type-C USB 3.1 Gen1 (requires low profile mezzanine expansion card w. front panel I/O)
      • Support for Type-C locking plugs (dual screw) according to the 'Locking Connector Spec. Rev. 1.0'
      • Option DisplayPort Alt Mode on lower Type-C connector (3rd video monitor output)

      CompactPCI® Serial Backplane Resources
      • PICMG® CPCI-S.0 CPU card & system slot controller
      • 16 x PCIe Gen3 8GT/s (2 links x 8 for two fat pipe slots, derived directly from the Intel® Xeon® or Core™ CPU
      • 6 x PCIe Gen3 8GT/s (6 links x 1 for peripheral slots)
      • 2 x SATA 6G (from CM238 PCH)
      • 4 x SATA 6G (Marvell hardware RAID controller)
      • 5 x USB2, 3 x USB3 (from CM238 PCH)
      • Option 8 x Gigabit Ethernet Marvell 88E6390 switch, requires S80-P6 low profile mezzanine expansion card
      • Option 4 x Gigabit Ethernet Intel® I210-IT NIC, requires S82-P6 low profile mezzanine expansion card

      Local Expansion & Mezzanine Mass Storage Options
      • Mezzanine side card connectors for local expansion
      • Low profile mezzanine modules available (4HP front panel) and also side cards (8HP F/P assembly)
      • P-EXP - Legacy (from PCH)
      • P-HSE1 - configurable as 4 x SATA 6G or 4 x PCIe (from CM238 PCH), 1 x USB3
      • P-HSE2 - 4 x PCIe (from CM238 PCH) & 3rd DisplayPort (from CPU)
      • 4HP Low profile mezzanine module preferred options:
      • C47-MSATA Mezzanine module - 2 x mSATA SSD sockets
      • C48-M2 Mezzanine module - 2 x M.2 2280 SATA SSD sockets
      • S20-NVME Mezzanine module - 1 x M.2 2280 NVMe SSD socket, 1 x Type-C USB F/P connector
      • S40-NVME Mezzanine module - 1 x M.2 2280 NVMe SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C USB F/P Connector (1 connector enabled for DisplayPort alternate mode)
      • S80-P6 Mezzanine module - 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector (TSN/AVB switch based solution)
      • S82-P6 Mezzanine module - M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
      • Custom specific storage & I/O mezzanine module design
      • 8HP/12HP Mezzanine side card options
      • SCL-RHYTHM Quad port GbE NIC, front panel M12 X-coded receptacles, dual M.2 (NVMe/SATA) SSD
      • SCZ-NVM Dual M.2 NVMe SSD, quad UART
      • P01-M12 Replacement for RJ45 GbE jacks by M12-X receptacles
      • Custom specific side card design - I/O and storage

      Environmental & Regulatory
      • Suitable e.g. for industrial, transportation & instrumentation applications
      • Designed & manufactured in Germany
      • ISO 9001 certified quality management
      • Long term availability
      • Rugged solution
      • Coating, sealing, underfilling on request
      • Lifetime application support
      • RoHS compliant
      • Operating temperature 0°C to +70°C
      • Operating temperature -40°C to +85°C (industrial temperature range) on request
      • Storage temperature -40°C to +85°C, max. gradient 5°C/min
      • Humidity 5% ... 95% RH non condensing
      • Altitude -300m ... +3000m
      • Shock 15g 0.33ms, 6g 6ms
      • Vibration 1g 5-2000Hz
      • MTBF 11.9 years
      • EC Regulatory EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)

      RT OS Board Support Packages & Driver
      • LynxOS - on request
      • On Time RTOS-32 - on request
      • OS-9 - on request
      • QNX
      • Real-Time Linux (RT Patch) - on request
      • RTX - on request
      • VxWorks 5.5 & 6.9 - on request
      • VxWorks 7.0 - on request
      • Others - on request