Form Factor- Proprietary size mezzanine module
- Fits basically into the 4HP (20.3mm) envelope of the CPU carrier board
- Typically delivered as a ready to use assembly unit (including CPU card)
- Mounting position right (on top of a CPU board
|
Host I/F Connectors HSE1/HSE2- High speed mezzanine connectors
- Suitable for PCI Express® Gen3
- Bottom mount male connectors HSE1 and HSE2 (high speed expansion)
- Mating with the carrier card female connectors HSE1/2
- Board-to-board height 10.8mm for a 4HP assembly
HSE1- PCI Express® 1x4 support (dedicated to the NVMe SSD module M.2 socket
- Power sourcing 12V/1.5 A maximum continuous current (2 pins)
HSE2- PCI Express® 4x1 support (dedicated to the PCIe® based on-board Gigabit Ethernet controllers)
- Power sourcing 12V/3.0 A maximum continuous current (4 pins)
|
M.2 NVMe Module Connector- Single M.2 socket, maximum M.2 size 2280 (M.2 formerly known as NGFF)
- Suitable for M.2 NVMe SSD module, key Id M, PCIe x4 I/F
- PCIe x4 sourced via HSE1 mezzanine connector
- Maximum (theoretical) 32Gbps I/O data transfer rate (Gen3 PCIe 8GT/s)
- Power switch, undervoltage lockout, short-circuit protection, quick discharge
|
Gigabit Ethernet NICs- Four independent Intel® I210-IT PCI Express® Gigabit Ethernet controllers
- 9.5KB Jumbo Frame support
- Hardware-based time stamping (IEEE 1588)
- 802.1AS Timing and Synchronization for Time-Sensitive Applications
- IEEE 802.1Qav compliant Audio-Video Bridging (AVB)
- IPv4, IPv6, TCP/UDP checksum offloads
- Based on four PCI Expess® x1 links derived from the mezzanine connector HSE2
- Driver support for all major operating systems
|
Applications- Low profile mezzanine module for EKF CPU Cards (SC4-CONCERTO and later)
- 4HP assembly CPU carrier board and S82-P6 mezzanine card
- Adds SSD mass storage and backplane Ethernet networking to the CPU carrier
- M.2 based mass storage, 1 x M.2 PCIe x4 socket (NVMe)
- On-board GbE NICs for backplane communication and multiprocessing via backplane connector P6, four GbE ports (suitable for single star architecture or full mesh or RIO)
|
Environmental & Regulatory- Designed & manufactured in Germany
- ISO 9001 certified quality management
- Long term availability
- Rugged solution
- Coating, sealing, underfilling on request
- Lifetime application support
- RoHS compliant
- Operating temperature 0°C to +70°C
- Operating temperature -40°C to +85°C (industrial temperature range) on request
- Storage temperature -40°C to +85°C, max. gradient 5°C/min
- Humidity 5% ... 95% RH non condensing
- Altitude -300m ... +3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
- MTBF 49.0 years
- EC Regulatory EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
|