General 
- Low Power X86 based boxed PC, for DIN rail mount or wall mount
- Intel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable AC600/AC610 versions)
- Versatile standard front I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)
- Choice of two versions - without (AC600) or with (AC610) wireless networking
- SMA/SMA-RP antenna connectors (AC610)
- Dimensions: 30mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC600)
- Dimensions: 40mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC610)
- Metal case, TS35 DIN rail bracket or wall mount plate
- M12 power connector
- Option terminal block power connector
- Option desktop power adapter connector
- Nominal 12V/24VDC power input operation
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Front I/O
- Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)
- 1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate front ports
- Dual USB 3.0 Type-A receptacles
- Dual DisplayPort connectors
- M12-A DC power connector
- Option terminal block 3.5mm pitch 4-position screw lock (bottom of box) power input
- Option rear power connector (desktop supply 4-pos. circular connector)
Additional I/O AC610
- AC610 is the wireless version of AC600 with AC010 mezzanine module (40mm front width)
- SMA/SMA-RP front antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5
- Dual Micro-SIM card slot for WWAN modem up to 5G
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Processor- Intel® Apollo Lake (APL-I) SoC E39xx Series
- x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
- x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
- x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
- Graphics Burst, CPU Burst, Intel® Speedstep®
- Intel® Virtualization Technology (Intel® VT-x / VT-d)
- Intel® Trusted Execution Engine (Intel® TXE) 3.0
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Firmware- Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
- Fully customizable by EKF
- Secure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®
- Windows®, Linux and other (RT)OS' supported
* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS' |
Main Memory- Integrated memory controller up to 8GB DDR3L 1600 +ECC
- Soldered memory for rugged applications
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Mass Storage- On-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)
- Up to 2TB capacity as of current - refer to AC600/610 SKUs
- Option front I/O Micro SD Card socket (SDHC, SDXC), available on request
- SPI Flash 128Mbit (UEFI firmware and customer application data)
- Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)
- Option mezzanine storage expansion via P-HSE connector (up to 2 x PCIe®, 1 x USB 3.0)
- Option custom specific mezzanine board design on request
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Graphics- Integrated HD Graphics Engine, Gen 9 LP
- DirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3
- HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8
- HW video encode H264, SVC, AVC, MVC, MPEG-2
- Content protection PAVP, HDCP 1.4
- 2 x DisplayPort front panel connectors
- DisplayPort™ 1.2a
- Max Resolution 4096 x 2160 @60Hz
- Audio streams encoded
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Networking- Dual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
- Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
- IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
- IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
- IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
- Two front port M12-X connectors
- Option 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)
Wireless Networking AC610- Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)
- Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)
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APL SoC I/O Usage- 2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIe®/SATA)
- 2 x PCIe® to 2 x I210-IT networking controllers
- 2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)
- 1 x USB 3.0 to P-HSE high speed expansion port connector
- 2 x USB 3.0 to front panel connectors
- 2 x DisplayPort to front panel connectors
- 1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
- SDIO (Micro SD Card) front panel slot (option, available on request)
- LPC to TPM 2.0 module (option)
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Building Blocks- 2 x Gigabit Ethernet controllers Intel® I210IT (front panel)
- Option 1 x Intel® I210-IS (for SerDes networking expansion port connector P-EXP)
- M.2 socket for 2280 SSD
- Option e•MMC (embedded MMC 5.0 64GByte HS400)
- Option Trusted Platform Module TPM 2.0
AC610 Additions- M.2 socket for 2230 Wi-Fi module
- M.2 socket for 3042 WWAN module (up to 3052 & 3060 extended 5G module)
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Security- Trusted Platform Module (option)
- TPM 2.0 for highest level of certified platform protection
- Infineon Optiga™ SLB 9665 cryptographic processor
- Conforming to TCG 2.0 specification
- AES hardware acceleration support (Intel® AES-NI)
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Local Expansion- Mezzanine card connectors P-HSE and P-EXP for optional local expansion
- P-HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0
- Choice of P-HSE based mezzanine I/O or storage modules
- AC010 P-HSE based wireless module for Wi-Fi, Bluetooth, WWAN connectivity (AC610)
- Custom specific P-HSE based mezzanine module design
- Custom specific box design for utilization of P-HSE custom I/O mezzanine modules
- Option P-EXP connector - Gigabit Ethernet SerDes I/F derived from I210-IS NIC
- Custom specific box design for utilization of P-EXP together with Gigabit Ethernet switch card
- Custom specific P-EXP based mezzanine switching module design
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Power Requirements
- DC Input, 9V-30V (12VDC, 24VDC nominal input voltage)
- Power consumption 25W max.
- Fast acting chip fuse (PCB soldered type - no replacement on-site)
- Protected against reverse polarity
- ESD protection (TVS)
- Common mode input filter
- M12-A 5-pin front panel power connector
- Option terminal block 3.5mm pitch 4-position screw lock (bottom of box) power input
- Option rear power connector (desktop supply 4-pos. circular connector)
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Applications
- Ultra compact industrial PC
- X86 code compatibility for rapid time to market
- Machine control
- Kiosk systems, information panels
- Dual 4k display solution, independent operation
- Single display or headless applications
- Industrial networks - IIoT
- Cable and wireless networking
- Router, bridges
- Rugged environments, DIN rail or wall mount options
- Edge computing
- Vehicles, transportation
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Environmental, Regulatory
- Designed & manufactured in Germany
- Certified quality management according to ISO 9001
- Long term availability
- Rugged solution
- RoHS compliant
- Operating temperature -40°C to +85°C (industrial temperature range) available
- Storage temperature -40°C to +85°C, max. gradient 5°C/min
- Humidity 5% ... 95% RH non condensing
- Altitude -300m ... +3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
- Protection class IP20
- EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
- MTBF tbd years
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